Non contact thickness and integrated measurement of three-dimensional micro nano morphology
Integrating thickness measurement module and 3D morphology and roughness measurement module, thickness and roughness measurement can be completed using one machine TTV、LTV、BOW、WARP、 Measurement of roughness and three-dimensional morphology.
High precision thickness measurement technology
Efficient scanning of WAFER is carried out using high-resolution spectral confocal imaging technology, coupled with multi degree of freedom electrostatic discharge coating vacuum suction cups. The wafer size can support up to 12 inches, and MAPPING tracking technology is used. It can be programmed to include automatic measurement of multiple points, lines, and surfaces.
High precision 3D shape measurement technology
Using optical white light interferometry technology, precision Z-direction scanning module and high-precision 3D reconstruction algorithm, the Z-direction resolution can reach up to 0.1NM; Unique vibration isolation design greatly reduces ground vibration and airborne sound wave vibration noise, achieving extremely high measurement repeatability.
