Wafer binding machine,Yuanlang intelligent technology

Wafer bonding machine

solution

From component assembly, testing, to packaging, the whole process of automated production

Ensure the consistency of product production parameters and greatly improve the production efficiency of products

Wafer testing machine

Wafer binding machine

99.9%

Yield

2S/PCS

Whole line efficiency

85%

OEE

Equipment parameters

Pasting accuracy ± 0.2um (standard piece, main binding head); Um (chip mounting, main binding head) equipment efficiency 5S (standard piece, one PICK&PLACE); Excluding eutectic temperature curve

The binding head of the mounting system can be seen in the high-precision binding head system (1 main and 3 auxiliary binding heads in total): 4 binding heads can automatically change the suction nozzle

X/Y/Z stroke: 320MMX580MMX50MM

Stroke of rotating shaft: ± 360 °; Repeated positioning accuracy: 0.02 ° (main binding head), 0.06 ° (auxiliary binding head)

MINIMUM SUCTION SIZE 0.15 * 0.2MM

Main pressure binding head 10-200G ± 10% (pressure closed-loop real-time feedback, optional 10-2000G); Auxiliary binding head 20-80G ± 5G (pressure closed-loop real-time feedback)

Equipment highlights

The equipment has high stability and can meet the needs of mass production

The structure is compact and reasonable, and the floor space is small

The equipment has a high degree of modularity and fast changeover

Equipment Introduction

X/Y/Z stroke

On demand customization

Utilization rate

90%

Assembly process

On demand customization

Sticking precision

±1.5μm (standard tablet); ±3μm (chip mounting)

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